Read the package set
Identify fine-pitch, BGA, THT and odd-form requirements.
Technical capability
PCB Assembly Capability Overview
XFPCB provides PCB assembly capability covering SMT, through-hole, mixed technology, turnkey purchasing and inspection - delivered from Shenzhen with ISO 9001:2015 quality management.
Capability Snapshot
Use this page to see what assembly technologies XFPCB supports end-to-end. Child pages go deeper on SMT, THT, LED, lead-free and volume models.
Capabilities are process-oriented: we match stencil, placement, solder method and inspection to your package list rather than forcing one generic recipe.
How We Map Capability to Your Board
Choose process path
SMT-only, THT-only or mixed with selective solder as needed.
Add supply model
Turnkey, kitted or hybrid purchasing.
Set inspection
AOI baseline; X-ray/functional as specified.
Capability Boundaries We Discuss Up Front
- Extremely fine packages need clear datasheets and may need X-ray.
- Press-fit and odd-form may need fixtures - share drawings early.
- Formal product certifications remain the customer responsibility unless scoped.
- Stencil and PCB fab can be bundled with assembly for one schedule.
Capability Areas
| Project Area | XFPCB Guidance |
|---|---|
| SMT | Chip parts through fine-pitch IC, QFN, BGA |
| THT | Connectors, relays, transformers, terminals |
| Supply | Turnkey purchasing or consigned kits |
| Quality system | ISO 9001:2015 managed processes |
Pick the Right Child Page
Technology Pages
See SMT, through-hole, mixed and LED pages for process detail.
Business Model Pages
Use turnkey, low-volume, high-volume or quick-turn pages for order style.
Inspection Pages
Link out to X-ray and flying probe resources when test is in scope.
Useful Terms
- PCBA
- Printed circuit board assembly.
- Fine-pitch
- IC leads with tight spacing requiring precise paste/placement.
- Turnkey
- Manufacturer supplies boards and components.
- Odd-form
- Parts needing special fixtures or hand steps.
Related XFPCB Pages
PCB Assembly Capability Overview FAQs
Where is assembly performed?
At XFPCB Shenzhen operations, coordinated with PCB fabrication and export packing for overseas customers.
What is the finest package you support?
Fine-pitch ICs, QFN and BGA are routinely supported. Send the specific package drawing for unfamiliar parts so we can confirm.
Can capability include stencil and PCB fab?
Yes. Many customers order fab + stencil + assembly together for one revision-controlled job.
How do I know which service page to use?
Choose by technology (SMT/THT/LED) or by order model (prototype, quick-turn, volume, turnkey). This capability page is the map.
Request a PCBA Capability Quote
Share your package list and volume model so we can point you to the right process path and quote accurately.
- Attach BOM and board outline or Gerbers.
- Note BGA/QFN/THT content.
- State turnkey vs consigned parts.