Quality-systems guidance for PCB fabrication and PCBA - control plans, inspection checkpoints, documentation, and how XFPCB maintains consistent manufacturing quality from CAM to shipment.
A jumper or a replaced part on the bench is still not a build instruction. Sort the fix into rework, an artwork change, or a remake before the factory quotes the next lot.
Read articleMap of the IPC documents behind a prototype board and assembly, how to write the IPC callout on a prototype drawing, and when prototypes must match the production class.
Read articleLamination voids, delamination, blisters and measling are different defects with different causes. How each forms, how microsections tell them apart, and what buyers can control.
Read articleWhere PCB open circuits start in fabrication and assembly, the signature each leaves, why some pass bare-board test and open after reflow, and which check finds each cause.
Read articleHow to plan a PCB or PCBA factory visit that produces evidence: desk checks, records to request, walking the line in process order, tracing one lot, and the engineering session.
Read articleLocate where PCB warping started (incoming bare board, reflow, or package-to-board mismatch at temperature), collect the right evidence, and assign the fix to the right owner.
Read articleAnswer-first China-fab guide to IPC Class 3 PCB fabrication: class vs AS9100 myths, annular ring and plating differences vs Class 2, inspection depth, cost of over-specifying, and RFQ language that sticks.
Read articleAnswer-first China PCBA guide to through-hole assembly: when THT stays on modern boards, wave vs selective vs hand, mixed SMT+THT sequence, hole-fill class, and RFQ fields that prevent quote surprises.
Read articleAnswer-first factory guide to conformal coating on the PCBA line: clean-mask-apply-cure-inspect, coating vs potting, IPC-CC-830 myths, thickness/keep-outs, and China RFQ fields.
Read articleHow to tell if a printed circuit board is bad: unpowered signs, safe test order, short-to-ground method, and a repair vs scrap matrix for buyers and techs.
Read articleRFQ-ready PCB inspection guide for procurement and QA: inspect vs test, SPI for paste risk, AOI limits under BGA, when to require X-ray, flying probe vs ICT by volume, China fab tiers, and pasteable coverage clauses.
Read articleQA and assembly guide to circuit board repair: PCB failure families, localized rework shops actually do, IPC-7711/21 heat-cycle limits (~3 Class 2/3 attempts), scrap triggers, and remake RFQs that capture root cause for XFPCB.
Read articleShop-floor guide to PCB repair vs replace: unpowered look/smell/magnify checks, heat vs power-rail failure families, solder fatigue vs corrosion, and remake RFQ notes after field returns.
Read articleIncoming material checks, process window control, defect taxonomy, outgoing inspection criteria, and documentation practices relevant to PCB and PCBA buyers.
See the Quality Management page under PCB Manufacturer, and contact Technical Support for project-specific inspection or documentation requirements.