Gerber intake
Read paste or copper pads; confirm fiducials and frame needs.
An SMT stencil controls paste volume. XFPCB fabricates laser-cut stencils and reviews apertures against your pad geometries so fine-pitch and large thermal pads print predictably.

Wrong aperture reductions cause insufficient solder on BGAs or bridging on fine-pitch QFPs. XFPCB treats stencil design as part of assembly DFM, not a commodity cut.
Order stencils alone or with PCBA. Share Gerber paste layers or pad copper so we can propose thickness and reductions.
Read paste or copper pads; confirm fiducials and frame needs.
Apply reductions for fine-pitch; keep volume on thermal pads.
Cut stainless steel, clean, and verify critical openings.
Deliver the stencil or retain it for XFPCB SMT printing.

| Project Area | XFPCB Guidance |
|---|---|
| Material | Stainless steel laser-cut foil |
| Design input | Paste Gerber preferred; copper pads acceptable |
| Options | Framed / frameless, step stencil, nano-coat |
| Use case | Prototype through production SMT |
Openings are reduced appropriately to limit bridging on tight lead pitches.
Large pads may use windowed apertures to control voiding.
Foil thickness is chosen from the mix of tiny and large pads on your board.
A paste-layer Gerber is ideal. If unavailable, copper pad layers plus a note on which pads are pasted can work.
Framed stencils suit repeated production on printers; frameless can work for prototypes - tell us your printer type.
When the board mixes very small and very large pads that cannot share one foil thickness cleanly.
Yes. Many turnkey jobs include stencil fabrication used directly on our SMT line.
Send paste Gerbers and note fine-pitch or BGA packages so aperture rules are set correctly.