Thermal Design Meets Assembly Reality
MCPCB spreads heat under LED packages; driver boards on FR-4 handle power conversion. XFPCB supports both and can align stencil apertures for thermal pads so voiding stays controlled.
Share CCT/binning rules if optical matching matters for the fixture family.
Environment & Application Constraints
- Indoor fixtures vs outdoor/IP-rated luminaires change coat and corrosion needs.
- High ambient temperatures push MCPCB and High-Tg driver boards.
- Surge and isolation requirements belong on the schematic - tell us if slotting is required on the PCB.

