Compatibility review
Confirm board finish and component terminations match lead-free reflow.
PCB assembly
Lead-Free PCB Assembly Service
XFPCB assembles boards with lead-free solder processes suited to RoHS-oriented products. We align PCB surface finish, component termination and reflow profiles so joints meet the higher temperature window of SAC alloys.
Lead-Free Is a Process System
Lead-free assembly is not only a solder spool change. Finish (ENIG, lead-free HASL, OSP), component termination metallurgy and moisture control all affect wetting and reliability.
Tell us if any parts are exempt or intentionally tin-lead; mixing chemistries without a plan creates weak joints.
Lead-Free Process Focus
Profile setup
Set SAC-appropriate soak/peak while respecting component max ratings.
MSD control
Bake or monitor floor life for moisture-sensitive packages when data is provided.
Inspect joints
AOI for visible joints; X-ray for BGA/QFN as required.
Lead-Free Controls
- Do not mix tin-lead and lead-free on the same board unless you explicitly engineer a dual process.
- OSP finishes need timely assembly after fabrication - share schedule constraints.
- Thicker boards or heavy copper may need tailored profiles - call them out.
- Documentation can note lead-free process when you need it for customer files.
Lead-Free Quotation Focus
| Project Area | XFPCB Guidance |
|---|---|
| Solder | Lead-free SAC family for SMT reflow |
| Finishes commonly paired | ENIG, lead-free HASL, OSP, immersion silver |
| Risk items | MSL parts, large BGAs, mixed metallurgy BOMs |
| Customer input | RoHS status per line and any exemptions |
Lead-Free DFM Checklist
Finish Match
We verify the bare-board finish is suitable for the lead-free profile you expect.
Temperature Limits
Components with low peak ratings are flagged before reflow programming.
Moisture Plan
MSL parts get baking/floor-life handling when you provide MSL levels.
Useful Terms
- RoHS
- Restriction of hazardous substances framework affecting material choices.
- SAC
- Tin-silver-copper lead-free solder alloy family.
- ENIG
- Electroless nickel immersion gold finish.
- MSL
- Moisture sensitivity level.
Related XFPCB Pages
Lead-Free PCB Assembly Service FAQs
Is all XFPCB assembly lead-free by default?
Lead-free is our standard direction for RoHS-oriented builds. If you need a special process, state it explicitly on the RFQ.
Which PCB finish works best for lead-free?
ENIG is common for fine-pitch; lead-free HASL and OSP are also used. Finish choice should match shelf life and assembly schedule.
Can you assemble a mixed RoHS / exempt BOM?
Only with a clear plan. Identify exempt lines and whether tin-lead process is truly required.
Do you provide material declarations?
We can support documentation based on supplier data for parts we purchase; share your required format early.
Request a Lead-Free Assembly Quote
Note RoHS expectations, board finish and any temperature-limited components on your RFQ.
- State lead-free requirement and any exemptions.
- Include PCB finish and heavy-copper notes.
- List MSL-sensitive or low-temp-rated parts.