Laminate and core-focused articles for stackup planning - substrate families, dielectric behavior, copper-clad constructions, and how XFPCB builds manufacturable multilayer structures.
Tg by DSC is not Tg by TMA, and a megahertz Dk is not a gigahertz Dk. How to compare two laminate quotes, and why an embedded resistor foil is not another row on that sheet.
Read articlePET flex is cheap and clear but cannot take normal reflow. Decide by assembly method: low-temp solder, conductive adhesive or connectors, etched vs printed, and when PEN or PI wins.
Read articleAnswer-first China-fab guide to PCB substrates: what substrate means (core/prepreg), FR-4 as a grade not a single recipe, when flex/MCPCB/ceramic make sense, and RFQ fields that stop wrong-material quotes.
Read articleConnector-first guide to PCB finished thickness from 0.8 to 2.0 mm: edge-card fit vs 1.57-1.6 mm defaults, finished thickness vs core myth, impedance geometry, thin-panel reflow support, when 2.0 mm earns cost, and RFQ stackup callouts.
Read articleChina fab substrate guide to polyimide vs FR-4: dynamic vs static bend class, PI film thermal and chemical strengths, moisture bake and cost tradeoffs, RA copper and adhesiveless flex life, rigid-flex hybrids, and RFQ callouts that stop over-spec and under-spec.
Read articleNPI cost guide to prototyping circuit boards: when solderless breadboards stop matching SMT fab reality, FR-4 layer and copper choices that avoid overbuying multilayer, CAM documentation that cuts EQ delays, and bring-up habits that protect the first panels.
Read articleCore and prepreg choices set thickness, impedance, thermal behavior, and CAF risk. Wrong dielectric assumptions force CAM changes late in the quote or fab cycle.
Only when electrical or qualification needs require it. Many FR4 builds allow approved equivalents; high-frequency or automotive programs may need named laminates in the fab notes.